Every day, data centers carry more of the world’s work, AI training, cloud storage, streaming, and high-performance computing. As power density surges, so does the heat. Racks that once ran comfortably now push past 30kW, and GPUs spike faster than traditional cooling can respond. 

PFAS-Free Synthetic Fluids for Immersion & Cold Plate (Direct-to-Chip) Cooling 

At Perstorp, we develop PFAS-free, readily biodegradable synthetic cooling fluids designed for both immersion cooling and cold plate (direct-to-chip) cooling. Our purpose is simple, to give operators a safe, efficient, and future-ready way to cool their most valuable systems. 

The New Cooling Reality for Data Centers 

As AI and HPC workloads grow, data center operators face challenges that can’t be solved with air cooling: 

  • GPU-heavy racks run hotter than ever 
  • Airflow and water use increase 
  • Power and cooling costs rise 
  • PFAS-based fluids face global phase-out 
  • Hardware density keeps climbing 

This is why more data centers are shifting to liquid cooling. It delivers: 

  • Lower PUE 
  • Higher rack density 
  • Stable temperatures under heavy loads 
  • Reduced water and power use 
  • Better fire safety and long-term reliability 

Liquid cooling is becoming essential for AI- and HPC-ready infrastructure. 

Synmerse™ DC – Immersion Cooling Fluids for High-Density Data Centers 

PFAS-free. Readily biodegradable. Built for safe and reliable cooling. 

The Synmerse™ DC line is engineered for immersion cooling systems running intensive AI, ML, and HPC workloads. In testing with leading OEMs and ODMs, the fluids consistently deliverthe stability, safety, and thermal efficiency needed for modern data centers. Perstorp offers different grades, for different cooling needs.  

What sets it apart: 

  • Excellent heat-transfer performance 
  • High flash and fire point for safer operation 
  • Low maintenance and extended fluid life 
  • Excellent material compatibility with next-gen hardware and key components 
  • PFAS-free and readily biodegradable 

Read more about Synmerse™ DC >> 

Synplate™ - Dielectric Fluids for Cold Plate cooling

A safer path to reliable chip-level cooling. 

Cold plate (direct-to-chip) cooling brings fluid directly to the CPU or GPU. As chip power rises, this approach becomes essential for stable, reliable operation in dense AI and HPC environments. 

Our upcoming synthetic coolant is shaped by input from leading hardware developers and engineered for high-power processors, GPU clusters, and edge systems. 

It is being engineered to deliver: 

  • High dielectric strength for leak safety 
  • Strong material compatibility 
  • High flash point for improved fire safety 
  • PFAS-free, readily biodegradable chemistry 
  • Stable, long-lasting performance  

Built to support the thermal challenges of AI-ready, high-density server designs. 

Download the technical paper on how to improve operational safety, cooling efficiency, and reduce fluid maintenance for immersion cooling in data centers. 

Download technical paper

How Our Fluids Compare to Common Alternatives

Data centers use several types of cooling fluids. Here is a concise comparison of widely used options and how synthetic ester-based fluids offer safer, more future-ready performance.

Fluid Type Strengths  Limitations  Why Synthetic Fluids are better 
 Mineral Oil  Low cost  High viscosity, lower fire safety, not biodegradable  Higher safety, better heat transfer, more stable long-term
 Propylene Glycol (PG25)  Common in general cooling  Not dielectric, unsafe near electronics  Dielectric safety + engineered for chip-level heat loads
 PFAS-Based Fluids  Strong thermal history  Regulatory phase-out, persistent in environment  PFAS-free, biodegradable, sustainability profile
 Hydrocarbon Fluids  Moderate cost, common in immersion  Lower dielectric strength, limited sustainability  Higher dielectric stability + improved environmental profile

We compare to help you make informed, future-ready decisions, not to compete on claims.

Why Are PFAS-Free Synthetic Cooling Fluids Gaining Ground?

Across the data center industry, companies are moving away from PFAS-based fluids as regulations tighten, and environmental expectations rise. Operators want solutions that carry no long-term risk but still deliver strong heat transfer and safety.

Synthetic ester fluids offer a compelling alternative. They combine:

  • High fire safety
  • Strong dielectric performance
  • Excellent material compatibility
  • Long fluid life
  • Biodegradability

You get performance, safety, and sustainability, without PFAS.

Which Fluid Properties Matter Most When Cooling AI and High-Density Racks?

When cooling modern servers, fluid choice affects everything from uptime to efficiency. The most important properties to evaluate include:

  • Dielectric strength for safety around electronics
  • Flash and fire point for risk reduction in dense racks
  • Viscosity vs temperature for efficient circulation
  • Material compatibility with seals, coatings, metals, and plastics
  • Thermal and oxidative stability for long fluid life
  • Environmental profile (PFAS-free, biodegradable, low carbon footprint)

These are the qualities synthetic esters are engineered to deliver.

How Do Immersion and Cold Plate Cooling Fit Into Your Liquid Cooling Roadmap?

Immersion and cold plate cooling are not competing ideas, they’re complementary tools for different needs.

  • Immersion cooling is ideal for full-system heat loads, extreme density, and complete environmental isolation.
  • Cold plate cooling targets chip-level hotspots and is often easier to integrate into existing racks or hybrid designs.

Perstorp’s fluids are made to support both paths, so you can scale at your own pace.

Built on Experience. Backed by Science. Developed With You.

Every Perstorp cooling fluid is shaped in collaboration with leading OEMs, ODMs, engineers, data center designers, and sustainability teams who understand the challenges of real-world operations. Their insights guide our chemistry.

Our goal is simple: safe, reliable, sustainable cooling without compromise for the next generation of computing.

Download the Technical Paper >>

Logan Tseng

Business Development Director Engineered Fluids

+886 988 349 490

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