Every day, data centers carry more of the world’s work, AI training, cloud storage, streaming, and high-performance computing. As power density surges, so does the heat. Racks that once ran comfortably now push past 30kW, and GPUs spike faster than traditional cooling can respond.
PFAS-Free Synthetic Fluids for Immersion & Cold Plate (Direct-to-Chip) Cooling
At Perstorp, we develop PFAS-free, readily biodegradable synthetic cooling fluids designed for both immersion cooling and cold plate (direct-to-chip) cooling. Our purpose is simple, to give operators a safe, efficient, and future-ready way to cool their most valuable systems.The New Cooling Reality for Data Centers
As AI and HPC workloads grow, data center operators face challenges that can’t be solved with air cooling:
- GPU-heavy racks run hotter than ever
- Airflow and water use increase
- Power and cooling costs rise
- PFAS-based fluids face global phase-out
- Hardware density keeps climbing
This is why more data centers are shifting to liquid cooling. It delivers:
- Lower PUE
- Higher rack density
- Stable temperatures under heavy loads
- Reduced water and power use
- Better fire safety and long-term reliability
Liquid cooling is becoming essential for AI- and HPC-ready infrastructure.
Synmerse™ DC – Immersion Cooling Fluids for High-Density Data Centers
PFAS-free. Readily biodegradable. Built for safe and reliable cooling.
The Synmerse™ DC line is engineered for immersion cooling systems running intensive AI, ML, and HPC workloads. In testing with leading OEMs and ODMs, the fluids consistently deliverthe stability, safety, and thermal efficiency needed for modern data centers. Perstorp offers different grades, for different cooling needs.
What sets it apart:
- Excellent heat-transfer performance
- High flash and fire point for safer operation
- Low maintenance and extended fluid life
- Excellent material compatibility with next-gen hardware and key components
- PFAS-free and readily biodegradable
Read more about Synmerse™ DC >>
Synplate™ - Dielectric Fluids for Cold Plate cooling
A safer path to reliable chip-level cooling.
Cold plate (direct-to-chip) cooling brings fluid directly to the CPU or GPU. As chip power rises, this approach becomes essential for stable, reliable operation in dense AI and HPC environments.
Our upcoming synthetic coolant is shaped by input from leading hardware developers and engineered for high-power processors, GPU clusters, and edge systems.
It is being engineered to deliver:
- High dielectric strength for leak safety
- Strong material compatibility
- High flash point for improved fire safety
- PFAS-free, readily biodegradable chemistry
- Stable, long-lasting performance
Built to support the thermal challenges of AI-ready, high-density server designs.